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Semiconductor Things You Need To Know

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发布2022-12-05 18:35:46
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发布2022-12-05 18:35:46
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文章被收录于专栏:ADAS性能优化

Podcast EP102: A Brief History of eFPGA with Geoff Tate of Flex Logic

by Daniel Nenni on August 19, 2022

Dan is joined by Geoff Tate, CEO and Co-founder of Flex Logix. Geoff explains the embedded FPGA market, including some history, applications and challenges to deliver a product that customers really want. He provides some very relevant background on why... Read More

An EDA AI Master Class by Synopsys CEO Aart de Geus

by Daniel Nenni on August 19, 2022

I consider Dr. Aart de Geus one of the founding fathers of EDA and one of the most interesting people in the semiconductor industry. So it is not a surprise that Aart was chosen to attend the CHIPs Act signing... Read More

CEO Interview: Jay Dawani of Lemurian Labs

by Daniel Nenni on August 19, 2022

Jay Dawani is the co-founder & CEO at Lemurian Labs, a startup developing a novel processor to enable autonomous robots to fully leverage the capabilities of modern day AI within their current energy, space, and latency constraints. Prior to founding... Read More

The Metaverse: Myths and Facts

by Ahmed Banafa on August 18, 2022

Any new technology involves a certain amount of ambiguity and myths. In the case of the Metaverse, however, many of the myths have been exaggerated and facts were misrepresented, while the Metaverse vision will take years to mature fully, the... Read More

SoC Verification Flow and Methodologies

by Sivakumar PR on August 18, 2022

We need more and more complex chips and SoCs for all new applications that use the latest technologies like AI. For example, Apple’s 5nm SoC A14 features 6-core CPU, 4 core-GPU and 16-core neural engine capable of 11 trillion operations... Read More

Podcast EP101: Unlocking the True Potential of Wireless with Peraso Technologies mmWave Silicon

by Daniel Nenni on August 17, 2022

Dan is joined by Ron Glibbery, who co-founded Peraso Technologies in 2009 and serves as its chief executive officer. Prior to co-founding Peraso Technologies, Ron held executive positions at Kleer Semiconductor Intellon, Cogency Semiconductor, and LSI Logic. Dan and Ron... Read More

UVM Polymorphism is Your Friend

by Bernard Murphy on August 17, 2022

Rich Edelman of Siemens EDA recently released a paper on this topic. I’ve known Rich since our days together back in National Semi. And I’ve always been impressed by his ability to make a complex topic more understandable to us... Read More

Delivering 3D IC Innovations Faster

by Kalar Rajendiran on August 16, 2022

3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic of discussion. The technology was originally leveraged for stacking functional blocks with high-bandwidth buses between them. Memory manufacturers and other... Read More

ARC Processor Summit 2022 Your embedded edge starts here!

by Synopsys on August 15, 2022

As embedded systems continue to become more complex and integrate greater functionality, SoC developers are faced with the challenge of developing more powerful, yet more energy-efficient devices. The processors used in these embedded applications must be efficient to deliver high... Read More

Digital Twins Simplify System Analysis

by Dave Bursky on August 15, 2022

The ability to digitally replicate physical systems has been used to model hardware operations for many years, and more recently, digital twining technology has been applied to electronic systems to better simulate and troubleshoot the systems. As explained by Bryan... Read More

Time for NHTSA to Get Serious

by Roger C. Lanctot on August 14, 2022

In the final season of “The Sopranos,” Christopher Multisanti (played by Michael Imperioli) and Anthony Soprano (James Gandolfini) lose control of their black Cadillac Escalade and go tumbling off a two-lane rural highway and down a hill. Christopher dies (spoiler alert)... Read More

Spot Pairs for Measurement of Secondary Electron Blur in EUV and E-beam Resists

by Fred Chen on August 14, 2022

There is growing awareness that EUV lithography is actually an imaging technique that heavily depends on the distribution of secondary electrons in the resist layer [1-5]. The stochastic aspects should be traced not only to the discrete number of photons... Read More

What is Your Ground Truth?

by Roger C. Lanctot on August 14, 2022

When my son bought a 2020 Chevrolet Bolt EV a couple of years ago, I was excited. I wanted to see what the Xevo-supplied Marketplace (contextually driven ads and offers) looked like and I was also curious as to what clever... Read More

Recent Forum Threads

Chinese Chip Software Maker Behind Mystery Buyer UK Blocked

by Daniel Nenni on August 19, 2022

A Shanghai firm is behind the failed attempt to buy Pulsic UK is clamping down on China’s presence in sensitive sectors A two-year-old Shanghai-based developer of chip design software was behind an attempt to buy a British firm that regulators... Read More

Knowledge War, US to Restrict EDA Exports

by Arthur Hanson on August 18, 2022

Knowledge and its use is fast becoming the next area of conflict and war. Knowledge has always been controlled for hundreds of years; England had export controls of IP hundreds of years ago under threat of death. It didn't work... Read More

TSMC’s Initial 3nm HVM Yield To Be Better Than Its 5nm

by fansink on August 17, 2022

TSMC's N3 process to enter mass production in September, and the initial yield performance will be better than the initial stage of the 5nm N5 process. Does anyone recall what the initial 5nm HVM yield was? https://ctee.com.tw/news/tech/699083.htmlRead More

Collaboration and Cooperation over Conflict, Apple, TSM, Samsung

by Arthur Hanson on August 17, 2022

TSM and Apple have become the dominant players because of Steve Jobs writing a huge check for TSM to build a giga fab when Samsung stole much of the design and feel of the Apple Ecosystem. TSM as Morris Chang... Read More

No need for TSMC to take side between US and China: Q&A with Richard Thurston

by hist78 on August 17, 2022

This interview offers a different and interesting perspective from the former TSMC chief counsel Richard Thurston. "The Chips and Science Act 2022 signed by US president Joe Biden on August 9 is seen as an important move to boost US... Read More

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目录
  • Podcast EP102: A Brief History of eFPGA with Geoff Tate of Flex Logic
  • An EDA AI Master Class by Synopsys CEO Aart de Geus
  • CEO Interview: Jay Dawani of Lemurian Labs
  • The Metaverse: Myths and Facts
  • SoC Verification Flow and Methodologies
  • Podcast EP101: Unlocking the True Potential of Wireless with Peraso Technologies mmWave Silicon
  • UVM Polymorphism is Your Friend
  • Delivering 3D IC Innovations Faster
  • ARC Processor Summit 2022 Your embedded edge starts here!
  • Digital Twins Simplify System Analysis
  • Time for NHTSA to Get Serious
  • Spot Pairs for Measurement of Secondary Electron Blur in EUV and E-beam Resists
  • What is Your Ground Truth?
  • Recent Forum Threads
    • Chinese Chip Software Maker Behind Mystery Buyer UK Blocked
      • Knowledge War, US to Restrict EDA Exports
        • TSMC’s Initial 3nm HVM Yield To Be Better Than Its 5nm
          • Collaboration and Cooperation over Conflict, Apple, TSM, Samsung
            • No need for TSMC to take side between US and China: Q&A with Richard Thurston
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